Abstract:
The hardness and Young’s modulus of organic–inorganic hybrid coatings, synthesised using sol–gel technology, deposited on silicon and
copper were determined using indentations at low forces with a spherical tipped indenter and found to depend strongly on the size of the
organic substituent. The indentation creep response of the coating systems was compared based on fast loading rates and for different times at
maximum load. The adhesion characteristics of the coatings on copper were examined to ascertain the influence of the organic substituents on
the film cracking behaviour and debond tendencies. For this purpose, coated tensile test specimens were strained uniaxially in a universal
testing machine while the surface was examined using an optical microscope. The mechanical response was analysed from the multiple
cracking patterns observed and the extent of film delamination from the underlying substrate. The results indicate that the interfacial adhesion
and film toughness are dramatically affected by the nature of the organic substituent
