Implications of polishing techniques in quantitative X-ray microanalysis

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dc.contributor.author Nockolds Clive en_US
dc.contributor.author Phillips Matthew en_US
dc.contributor.author Remond Guy en_US
dc.contributor.author Roques-Carmes Claude en_US
dc.date.accessioned 2009-12-21T03:53:20Z
dc.date.available 2009-12-21T03:53:20Z
dc.date.issued 2002 en_US
dc.identifier 2004003042 en_US
dc.identifier.citation Remond Guy et al. 2002, 'Implications of polishing techniques in quantitative X-ray microanalysis', US Govt. Printing Office, vol. 107, no. 6, pp. 639-662. en_US
dc.identifier.issn 1044-677X en_US
dc.identifier.other C1 en_US
dc.identifier.uri http://hdl.handle.net/10453/5865
dc.description.abstract Specimen preparation using abrasives results in surface and subsurface mechanical (stresses, strains), geometrical (roughness), chemical (contaminants, reaction products) and physical modifications (structure, texture, lattice defects). The mechanisms involved in polishing with abrasives are presented to illustrate the effects of surface topography, surface and subsurface composition and induced lattice defects on the accuracy of quantitative x-ray microanalysis of mineral materials with the electron probe microanalyzer (EPMA). en_US
dc.publisher US Government Printing Office en_US
dc.relation.isbasedon http://nvl.nist.gov/pub/nistpubs/jres/107/6/cnt107-6.htm en_US
dc.title Implications of polishing techniques in quantitative X-ray microanalysis en_US
dc.parent Journal of Research of the national Institute of Standards and technology en_US
dc.journal.volume 107 en_US
dc.journal.number 6 en_US
dc.publocation Washington DC en_US
dc.identifier.startpage 639 en_US
dc.identifier.endpage 662 en_US
dc.cauo.name Science en_US


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