A 500?C isothermal section for the Al-Au-Cu system

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dc.contributor.author Levey, F en_US
dc.contributor.author Cortie, Michael en_US
dc.contributor.author Cornish, Lesley en_US
dc.contributor.editor en_US
dc.date.accessioned 2011-02-07T06:23:42Z
dc.date.available 2011-02-07T06:23:42Z
dc.date.issued 2001 en_US
dc.identifier 2006007354 en_US
dc.identifier.citation Levey F, Cortie Michael, and Cornish Lesley 2001, 'A 500°C isothermal section for the Al-Au-Cu system', Springer, vol. 33, no. 4, pp. 987-994. en_US
dc.identifier.issn 1073-5623 en_US
dc.identifier.other C1UNSUBMIT en_US
dc.identifier.uri http://hdl.handle.net/10453/13677
dc.description.abstract The Al-Au-Cu system and its associated ternary alloys and intermetallic compounds is surprisingly poorly known, and the authors could find no phase diagram for it in the literature. This article addresses this omission by presenting an isothermal section at 500 ?C, derived with the aid of X-ray diffraction (XRD), energy-dispersive spectroscopy (EDS), metallography, and hardness measurements. The samples studied had generally received an anneal of 2 hours at 500 ?C, primarily in order to complete any transformations that occurred during solidification and cooling of the castings. The possibility of further changes on protracted annealing at 500 ?C is not ruled out, and the diagram presented is, therefore, applicable only to material prepared by thermal processing of an industrial nature. The presence of a ternary ? phase with a nominal stoichiometry of AlAu2-x Cu1-x (0?x?1) was confirmed, and its phase field at 500 ?C was determined. A number of the binary intermetallic phases were found to exhibit some solid solubility of the ternary element. In particular, the ?-Al4Cu9 phase extends deep into the ternary and, in the vicinity of the commercially interesting 18-carat line, appears to exist in a ternary ordered form, designated here as ? 2 en_US
dc.language en_US
dc.publisher Springer en_US
dc.relation.isbasedon http://dx.doi.org/10.1007/s11661-002-0199-x en_US
dc.title A 500?C isothermal section for the Al-Au-Cu system en_US
dc.parent Metallurgical and Materials Transactions A en_US
dc.journal.volume 33 en_US
dc.journal.number 4 en_US
dc.publocation New York, USA en_US
dc.identifier.startpage 987 en_US
dc.identifier.endpage 994 en_US
dc.cauo.name SCI.Physics and Advanced Materials en_US
dc.conference Verified OK en_US
dc.for 091200 en_US
dc.personcode 0000020170 en_US
dc.personcode 020302 en_US
dc.personcode 0000020171 en_US
dc.percentage 100 en_US
dc.classification.name Materials Engineering en_US
dc.classification.type FOR-08 en_US
dc.edition en_US
dc.custom en_US
dc.date.activity en_US
dc.location.activity en_US
dc.description.keywords en_US

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